New ETEL Motion Platform Wins LEAP Award

December 12, 2019

LEAPSCHAUMBURG, IL (December 2019) – The ground-breaking new ETEL TELICA motion platform designed for semiconductor manufacturing was the recipient of the LEAP award at a ceremony in Santa Clara, CA, on December 9. Presented with the Silver LEAP (Leadership in Engineering Achievement Program) in the category of Motion Control, representatives of ETEL of the HEIDENHAIN group were on hand to accept.

TELICA is ETEL’s newly developed positioning platform dedicated to die bonding applications for back-end semiconductor processes. “TELICA offers users a new level of performance never before seen,” explained HEIDENHAIN Motion System Sales Engineer Daniel Wiseman. “Nothing else on the market can do this kind of speed at this kind of accuracy over such a large placement area.”

This new TELICA system allows users to handle the requirements of next generation advanced packages with a placement accuracy in the µm range, over a working space of up to 870 x 800 mm (therefore compatible with large panels 720 x 650), during extraordinary high duty cycles and throughput.

“We are honored to be recognized by the LEAP organization for this new industry development, and are committed to drive innovation both in motion systems and controls to provide highly differentiated solutions to our customers,” said Peter Suliga, HEIDENHAIN Regional Sales Manager, Motion Systems Division.

LEAP is a design engineering product competition celebrating the best components and services across the mechanical and electrical engineering design space across 13 categories. The awards program is supported by the three leading publications in design engineering: Design World, Fluid Power World and EE World.

ETEL S.A. is based in Switzerland with exclusive North American distribution through HEIDENHAIN CORPORATION in Schaumburg, IL.

Contact:
Kathleen Herrmann, HEIDENHAIN Public Relations Manager
333 E. State Parkway
Schaumburg, IL 60173
847-519-4702
kherrmann@heidenhain.us

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