September 9, 2026
HEIDENHAIN CORPORATION Empowers Semiconductor Manufacturing at SEMICON WEST 2026
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SEMICON West | October 13–15 | Booth #1639
Schaumburg, IL (September 2026) – HEIDENHAIN CORPORATION is pleased to announce its participation at SEMICON West 2026, taking place October 13–15 at the Moscone Center in San Francisco, California. Visit booth #1639 to explore how the HEIDENHAIN Corporate Group is empowering precision in semiconductor manufacturing through advanced encoder technology, motion systems, and precision metrology solutions.
As semiconductor manufacturing continues to evolve, increasingly complex devices and demanding production requirements are placing greater emphasis on motion accuracy, process stability, and measurement capability. At SEMICON West, HEIDENHAIN will showcase solutions from HEIDENHAIN, ETEL, RSF, and NUMERIK JENA, demonstrating how precision technologies can support equipment manufacturers across a range of semiconductor applications.
The HEIDENHAIN Corporate Group will highlight three key application areas:
Advanced Packaging – Precision motion and position feedback are critical to advanced packaging processes such as chiplet assembly and hybrid bonding. HEIDENHAIN and ETEL will showcase encoder, motion control, and positioning technologies designed to support the accuracy, stability, and dynamic performance required for these increasingly sophisticated applications.
High-End Automation – Semiconductor automation requires high-speed motion without compromising precision and repeatability. HEIDENHAIN, RSF, and NUMERIK JENA will demonstrate encoder technologies designed for demanding linear and rotary positioning applications, including high-resolution measurement solutions for advanced automation systems.
Metrology & Inspection – Precision measurement plays a critical role in verifying process performance and maintaining manufacturing consistency. HEIDENHAIN will highlight metrology and encoder technologies that support demanding measurement and inspection applications across semiconductor manufacturing and advanced packaging.
Together, these solutions demonstrate the breadth of the HEIDENHAIN Corporate Group and its ability to address the evolving precision requirements of semiconductor equipment manufacturers. By combining encoder technology, high-performance motion systems, and metrology expertise, HEIDENHAIN and its family of brands provide technologies that help enable greater accuracy, stability, repeatability, and production capability.
SEMICON West brings together semiconductor manufacturers, equipment suppliers, technology developers, and industry professionals to explore the technologies shaping the future of semiconductor manufacturing. Attendees are invited to visit HEIDENHAIN at booth #1639 to meet with experts and discover how precision technology can support their next innovation.
High-resolution images are available for the following: LIP 6000 D plus, GAP 1000, ETEL VULCANO2, ETEL ACCURET+, ERO 2900, RSF Encoder Solutions, NUMERIK JENA Encoder Solutions, HEIDENHAIN PP 6000, HEIDENHAIN LIC 4100 V, HEIDENHAIN MRP 5000.
Product contact:
Jonathan Dougherty, HEIDENHAIN Business Development Director
[email protected]
847-519-4218
Media contact:
Ursula Buol, HEIDENHAIN Marketing Manager
[email protected]
847-519-4212

