Empowering Precision for Semiconductor Manufacturing

SEMICON West 2026 promotional graphic featuring semiconductor manufacturing equipment and event details.

Visit HEIDENHAIN at SEMICON West | Booth #1639

Showcasing the latest advancements in encoder technology, motion systems, precision metrology, and semiconductor manufacturing automation.

October 13–15, 2026 | Moscone Center | San Francisco, CA 

The semiconductor industry continues to evolve, driven by increasingly complex devices and more demanding manufacturing requirements.

As precision becomes a critical enabler of process capability, the HEIDENHAIN Corporate Group provides encoder technology, motion systems, and metrology solutions that help equipment manufacturers improve consistency and production yield.

Visit HEIDENHAIN at Booth #1639 during SEMICON West to explore innovations from HEIDENHAIN, ETEL, RSF, and NUMERIK JENA.

Three Areas. One Precision Strategy.

Semiconductor manufacturing presents unique motion challenges at every stage of production. Whether enabling advanced packaging, supporting high-speed automation, or verifying machine performance through precision metrology, the common requirement is the ability to measure and control motion with exceptional accuracy.

The HEIDENHAIN Corporate Group addresses these challenges through a portfolio of precision encoder technologies, motion systems, and metrology solutions engineered for demanding semiconductor applications. At SEMICON West, we’ll highlight innovations across three key application areas.

Find the Innovations That Move Your Business Forward

Every manufacturing challenge is different. That’s why our booth is organized around three key areas that matter most to today’s manufacturers.

Advanced Packaging

Precision for increasingly sophisticated assembly processes.

Advanced packaging is transforming semiconductor manufacturing through technologies such as chiplet architectures and hybrid bonding. As process requirements become more demanding, precise motion and position feedback are critical for maintaining alignment, stability, and production yield.

HEIDENHAIN and ETEL combine precision feedback, advanced motion control, and high-dynamic positioning technologies to support the accuracy required for today’s advanced packaging applications.

Featured Technologies:

MULTI-DOF linear encoder technology providing additional position feedback across multiple degrees of freedom to improve motion accuracy and error compensation.

MULTI-DOF linear encoder technology providing additional position feedback across multiple degrees of freedom to improve motion accuracy and error compensation. Designed for high-dynamic, high-precision applications with EnDat 3 communication

GAP 1000 High-accuracy gap encoder for vertical out-of-plane distance measurement.

Featuring a precision OPTODUR measuring mirror, large measuring range, and high repeatability for demanding motion applications.

ETEL-VULCANO-2 Gantry stacked-axis architecture combining ETEL’s renowned iron-core linear motors, mechanical bearings.

Gantry stacked-axis architecture combining ETEL’s renowned iron-core linear motors, mechanical bearings, and HEIDENHAIN optical encoder technology to deliver exceptional geometric performance, high dynamics, and nanometer-level position stability.

ETEL-ACCURET+ High-performance controller platform engineered for semiconductor precision and scalable to any high-end positioning system.

High-performance controller platform engineered for semiconductor precision and scalable to any high-end positioning system.

Measures angular position and linear travel simultaneously, enabling precise multidimensional motion tracking in compact applications.

High-End Automation

Dynamic motion for precision manufacturing.

High-performance automation depends on motion systems capable of maintaining speed without sacrificing precision. From laser processing to compact positioning systems, encoder performance directly influences machine responsiveness, repeatability, and overall process capability.

Through the combined expertise of HEIDENHAIN, RSF, and NUMERIK JENA, the HEIDENHAIN Corporate Group offers precision encoder technologies engineered to support demanding automation applications across semiconductor manufacturing.

Featured Technologies:
Precision linear measuring systems with nanometer-range resolution capabilities and a broad portfolio of configurations for demanding automation applications.

Precision linear measuring systems with nanometer-range resolution capabilities and a broad portfolio of configurations for demanding automation applications. RSF solutions provide reliable, high-accuracy measurement for dynamic motion systems.

Precision optical encoders and length gauges for linear and rotary applications with demanding size and accuracy requirements.

Precision optical encoders and length gauges for linear and rotary applications with demanding size and accuracy requirements. Designed for reliable measurement and positioning in micrometer- and nanometer-range applications.

Metrology & Inspection

Confidence begins with measurement.

Metrology and inspection systems are essential to semiconductor manufacturing. In both front-end wafer fabrication and mid-end advanced packaging, these platforms verify that critical dimensions, overlay alignment, film thickness, and interconnect integrity meet extremely tight specifications. At advanced nodes, even nanometer-level deviations can directly impact yield, leading to yield losses and throughput compromise. Therefore, The HEIDENHAIN Corporate Group provides precision motion feedback technologies that support greater process stability and long-term reliability.

Featured Technologies:

Two-coordinate encoder providing simultaneous measurement in two directions to reduce Abbé errors and improve machine accuracy. EnDat 3 dual position feedback simplifies integration while supporting high-performance motion systems.

Absolute linear encoder designed for high-speed linear axes in vacuum environments. Vacuum-compatible construction, high cleanliness, and sub-nanometer measuring capability support reliable precision in demanding semiconductor applications.

Compact angle encoder module with integrated encoder and bearing for high-accuracy rotary motion applications. Designed for precise measurement and reliable performance in space-constrained systems.

Precision Through Collaboration

The future of semiconductor manufacturing depends on technologies that work together to deliver greater accuracy, stability, and performance.

The HEIDENHAIN Corporate Group combines the expertise of HEIDENHAIN, ETEL, RSF, and NUMERIK JENA to provide integrated motion, encoder, and metrology solutions for advanced semiconductor applications.

Visit Booth #1639 at SEMICON West to explore how precision technology can support your next innovation.

SEMICON West 2026

October 13–15, 2026

Moscone Center | San Francisco, CA

Booth #1639

Reserve a meeting with our team.

Discuss your product needs with our experts at SEMICON West.



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